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8:54
YouTube
Semi Tube
Wafer Bumping Process
Wafer bumping is an essential to flipchip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where “bumps” or “balls” made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips. Wafer Bumping Process is the key tech of the semiconductor.
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