Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
The High-Power-Density (HPD) servo joints deliver high torque density, fast dynamic response, high precision, reliability and cost efficiency. These three new modules address diverse industry needs ...
Data centers have become the foundation of modern digital infrastructure, but one of their most critical security layers ...
Abstract: Restoring high-quality images from degraded hazy observations is a fundamental and essential task in the field of computer vision. While deep models have achieved significant success with ...
The MAYA-W5 and NORA-W5 series easily add robust Wi-Fi 6 connectivity to devices while reducing global supply chain risks. Based on Texas Instruments chipsets, the MAYA-W5 and NORA-W5 series are ...
Ten days ago, in a moment of very high drama in orbit, NASA directed its astronauts living on the International Space Station to briefly seek emergency refuge in a Crew Dragon spacecraft. Since then, ...
LISLE, Ill., June 15, 2026 /PRNewswire/ -- Molex, a global electronics leader and connectivity innovator, announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed ...
The holidays have officially arrived. As Santa and his elves put the finishing touches on this year's toys, kids may be wondering how to send Jolly Ol' St. Nick their holiday wish list for 2025. After ...
As AI PCs demand more memory and power, the decades-old cooling fan is standing in the way. Ventiva’s radical fanless technology could be the answer to laptops' big design problem. I have been a ...
TAIPEI—As the AI PC era becomes a runaway train, laptop makers face an old nemesis: heat generated by hot-running chips. New AI-focused processors pack ever more CPU, GPU, and NPU horsepower into ...
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