This paper estimates that the macroeconomic damages from climate change are an order of magnitude larger than previously thought. Exploiting natural global temperature variability, we find that 1°C ...
I spent a few days testing the Reon Pocket Pro Plus ahead of its US launch. Here's how it went. Anna Gragert Senior Editor, ...
Abstract: Fatigue-induced delamination of the direct-bonded copper solder layer is a critical and latent failure mode in multichip insulated gate bipolar transistor (IGBT) power modules. To address ...
Abstract: To leverage the outstanding high-temperature resistance of silicon carbide (SiC), theoretically up to 500 °C, conventional packaging materials, and structures have become inadequate to meet ...
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