Design And Reuse

SkyeChip Advances Custom Interface IP Engagement with Cerebras for Wafer-Scale AI Platforms

SkyeChip Berhad (“SkyeChip”), a Bursa Malaysia-listed silicon IP and silicon products company, today announced its ongoing engineering engagement with Cerebras Systems Inc. (Nasdaq: CBRS), a global AI ...
Design And Reuse

CAST Licenses TCP/IP Hardware Stack Core for Keysight FieldFox Handheld Spectrum Analyzers

CAST, a leading provider of high-performance semiconductor IP cores, today announced that Keysight Technologies has licensed CAST’s 1G/10G TCP/IP Hardware Stack IP core for integration into its ...
Design And Reuse

Discuss Silicon-Ready UCIe IP at DAC 2026, Long Beach, California

T2M, a leading provider of high-performance semiconductor IP cores, today announced the availability of its partner’s advanced UCIe Die-to-Die Interface IP core, a scalable digital interconnect ...
Design And Reuse

High-Speed SerDes Design: Architecture, Equalization, and CDR Circuits

High-Speed Serializer/Deserializer (SerDes) technology addresses these challenges by enabling efficient communication over ...
Design And Reuse

Electronics Digital Twin platform from Synopsys for accelerating physical AI development

Open platform enables seamless integrations with a comprehensive technology ecosystem and cloud‑based deployment. By engineerlive.com. Synopsys has launched the Synopsys Electro ...
Design And Reuse

Imec extends auto chiplet program to edge computing

Imec is extending the lessons learnt in its Automotive Chiplet Program to an Autonomous Edge Chiplet Program (AECP) as an acknowledgment that the same foundational HPC building blocks can serve a ...
Design And Reuse

In the AI-native era, what exactly are autonomous vehicles competing on?

The development of Advanced Driver Assistance Systems (ADAS) and Autonomous Driving (AD) in the automotive industry is entering a new stage, and generative AI is becoming the core feature of this ...
Design And Reuse

Samsung Reaffirms 1.4nm Chips for 2029 and Adds an Enhanced SF1.4+ Node

Samsung Electronics has reaffirmed that it will begin mass production of its 1.4-nanometer process in 2029, and unveiled an enhanced SF1.4+ node for 2030, as it works to keep pace with TSMC and Intel ...
Design And Reuse

US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging

Samsung Electronics is reportedly in discussions with North American artificial intelligence (AI) company Anthropic to manufacture its custom AI chips through Samsung's foundry business. The chips are ...
Design And Reuse

Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden

Infineon Technologies AG (FSE: IFX) (OTCQX: IFNNY) opened the Smart Power Fab in Dresden several months ahead of schedule. The new plant, with an investment volume of five billion euros, is the ...
Design And Reuse

Socionext Addresses Datacenter Infrastructure Customer Demands for Advanced SoCs on TSMC A14 Technology

Socionext Inc., a global leading provider of advanced custom SoCs to the fastest growing segment of the semiconductor market, AI datacenter infrastructure, is announcing the development of a ...
Design And Reuse

Chips&Media to Supply APV IP for Future Google Smartphones

Chips&Media will supply its Advanced Professional Video (APV) intellectual property (IP) to Google for the first time, marking the company's entry into Google's smartphone ecosystem. The IP is ...