The race is on to build the massive chip packages that power the future of AI, with some technologies being developed to produce a single chip that houses a monstrous 58 chips in one unit. But the ...

TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

Advanced packaging allows multiple small chips to be connected, protected and tested to create a final larger chip like a graphics processing unit. Nvidia has reserved the majority of capacity at ...

TL;DR: NVIDIA's Blackwell wafers are now produced at TSMC's Arizona facility, marking a key milestone in US semiconductor manufacturing. However, these wafers require advanced CoWoS packaging, ...

As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT) giants ASE and ...

TSMC announced three new advanced process technologies at its North America Technology Symposium last week A13, A12 and N2U as part of its latest advanced technology roadmap. Compared to the roadmap ...

Nvidia will stay TSMC’s biggest customer in 2027, but AMD’s EPYC Venice could pinch the CPU bragging rights. TSMC is seeing rising demand for 2.5D advanced packaging as CPUs become more important in ...