To address the limitations of traditional partial discharge (PD) detection methods for switchgear, which fail to meet the requirements for real-time monitoring, rapid assessment, sample fusion, and ...

This study presents an efficient method for automatically identifying the crystal structure and orientation of Y-doped HfO 2-based thin films using deep learning. This approach enables large-scale ...

Longitudinal (top) and axial (middle) images of X-Ray CT data of parts with 6 internal defects: a spherical clog, a stellated shaped clog, a cone shaped void, a blob shaped void, an elliptical warp of ...

Automated optical inspection (AOI) is a cornerstone in semiconductor manufacturing, assembly and testing facilities, and as such, it plays a crucial role in yield management and process control.

AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields.

Researchers have developed a new method for detecting defects in additively manufactured components. Researchers at the University of Illinois Urbana-Champaign have developed a new method for ...