AZoM talks to DeWayne Howell and Jason Gabriel (Technical Engineering TenCate/CCS Composites), about the process of compression molding for composites and what the benefits and applications of this ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Predominantly, if the metal part used in compression molding is tension or compression loaded, a ratio of metal part thickness to its extensional modulus, multiplied by the Bulk Molding Compound (BMC) ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

Injection overmolding of unidirectional fibers and preforms is an attractive process for many good reasons. It’s fast, consistent and repeatable, and it can be performed with a machine that is ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...